The full climb — design to fab to test.
Six disciplines spanning the entire semiconductor value chain, drawn from a 50-module curriculum — beginner to advanced, online to cleanroom, each one mapped to a real job being hired today. This is the catalog. ChipReady AI sequences the right modules for you.
Semiconductor Foundations
The literacy every role is built on — how the industry, the device, and the chip actually work. Where the complete beginner starts.
Fabless & IC Design
RTL to tapeout — analog, digital, mixed-signal, VLSI and system-on-chip, on the same EDA tools the industry runs (Synopsys, Cadence).
Foundry & Fabrication
The cleanroom craft — crystal growth, lithography, deposition, etch, CMP and wafer processing, hands on real fab tools.
Integrated Device Manufacturing
Process integration at scale — CMOS and FinFET flows, device scaling, and the operations that run a working IDM.
Assembly, Test & Packaging
OSAT — die and wire bonding, flip-chip, 2.5D/3D advanced packaging, device test, failure analysis and yield optimization.
Materials & Metrology
Thin films, metallization, optical and high-performance materials, and the characterization instruments that tell the truth about every wafer.
Every course points to a paycheck.
Modules stack into recognized roles and credentials — from vocational certificates to advanced degrees. Here is where you start for each.
Not just slides. Real tools.
Advanced modules run in fabrication and measurement labs on production-grade equipment — virtual cleanroom simulations, then the real thing through our coalition's facilities.
Fabrication lab
Photolithography & mask alignment · Chemical & physical vapor deposition (PECVD, sputter, ALD) · Plasma & wet etch (Lam Research) · Oxidation/diffusion furnaces · Ion implantation · Chemical-mechanical polishing · Wafer bonding & dicing.
Measurement lab
Scanning electron microscopy (SEM) · Atomic force microscopy (AFM) · X-ray diffraction (XRD) · Ellipsometry & profilometry · Electrical characterization (parameter analyzers, probers) · Spectroscopy (SIMS, XPS) · Automated wafer inspection (KLA-Tencor).
What opens next.
AI Hardware
Accelerators and the silicon behind the models — where the next decade of demand concentrates.
Robotics & Automation
The machines that build the machines — embedded systems, control, and the automated fab.
Quantum
The next substrate — and the engineers who will be ready before the rest of the world is.
Don't pick modules. Let us compose your path.
Answer three questions. ChipReady AI sequences the exact modules to take you from where you are to the job you want.